| Moulded Metal Film Resistors |
| General Specification |
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| PRODUCT SPECIFICATION | |||||||
| TYPE | RATED POWER @ 70°C | Dimensions (in mm) | MAX WORKING VOLTAGE | RESISTANCE RANGE | |||
| L | D | l | d | ||||
| RNC 55 | 0.125 W | 6.35±0.8 | 2.39±0.8 | 38.1±3.1 | 0.6±0.02 | 200V | 10~1M |
| RNC 60 | 0.25W | 9.5±1.5 | 3.18±0.9 | 38±3.1 | 0.6±0.02 | 250V | 10~1M |
| Technical Specification | ||
| TEST | PROCEDURE | REQUIREMENTS |
| Dielectric withstanding Voltage | V-Block Method, 3X Rated
Voltage Duration : 1 Minute |
R
< ±0.15% +0.01 Ohm No Breakdown |
| Insulation Resistance | V-Block Method, DC 500V Duration; |
>104 M Ohm |
| Temparature Cycling | 5 Cycles of -65°C, 25°C, 150°C, 25°C | R < ±0.2% ± 0.01 Ohm |
| Short Term Overload | 2.5
X rated Voltage Duration - 5 seconds |
R < ±0.2% ± 0.01 Ohm |
| Moisture Resistance | 40°C,
95% relative humidity, Duration - 10 days |
R < ±0.4% ± 0.01 Ohm |
| Load Life | Rated
Voltage at 70°C ambient Duration - 2000 hrs. |
R < ±0.5% ± 0.01 Ohm |
| Robustness of Terminations | Tensile:
10N, Duration:10 seconds Bending: 180°, >3 bends Torsion; 3 Rotation of 360°C Each |
No Mechanical Damage R < ±0.5% ± 0.01 Ohm |
| Resistance to Soldering Heat | Temp
: 260°C ± 5°C Duration - 10 seconds |
R < ±0.1% ± 0.1 Ohm |
| Shock | 1 Km/S² | R < ±0.2% ± 0.01 Ohm |
| Vibration (High Frqquency) | 10 to 2000 Hz : 200m/s² | R < ±0.2% ± 0.01 Ohm |
| Low Temperature Exposure | At
-65°C Duration : 2 hrs. |
R < ±0.15% ± 0.01 Ohm |
| High Temperature Exposure | At
+175°C Duration : 2000 hrs., No load condition. |
R < ±2.0% ± 0.05 Ohm |
| Solderability | DIP
Method, solder Bath Temp : 230°C ±5°C Duration : 5 seconds |
>95% |
| Resistance to Solvents | Solvent: Tricloroethylene Duration: 1 Minute |
MIL-STD 202 Method 215 |
© 1999 MFR Electronic Components Pvt. Ltd.