| Metal Glaze Resistors |
| General Specification |
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PRODUCT SPECIFICATION Dimensions (in mm) |
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| TYPE | RATED POWER | DIMENSIONS (in mm) | MAX. WORKING VOLTAGE | RESISTANCE RANGE | |||
| L | D | l | d | ||||
| MGR 25 | 0.25 W | 6.3±0.5 | 2.3±0.5 | 28±0.2 | 0.6±0.02 | 1600 VDC | 100K~10M |
| MGR 50 | 0.50W | 9.0±0.5 | 3.5±0.5 | 26.5±0.2 | 0.8±0.02 | 3500 VDC | 100K~10M |
| Technical Specification | ||
| TEST | PROCEDURE | REQUIREMENTS |
| Dielectric withstanding Voltage | V-Block Method, 3X Rated
Voltage Duration : 1 Minute |
R
< ±0.5% ± 0.05 Ohm No Breakdown |
| Insulation Resistance | V-Block Method, DC 500V Duration;1 Minute |
> 104 M Ohm |
| Temparature Cycling | 5 Cycles of -65°C, 25°C, 150°C, 25°C | R < ±0.5% + 0.05 Ohm |
| Short Term Overload | 2.5
X rated Voltage Duration - 5 seconds |
R < ±1.5% + 0.05 Ohm |
| Damp Heat Steady State | 40°C,
95% relative humidity, Duration - 56 days |
R < ±1.5% + 0.05 Ohm |
| Load Life | Rated
Voltage at 70°C ambient Duration - 1 000 hrs. |
R < ±1.5% + 0.05 Ohm |
| Robustness of Terminations | Tensile:
10N, Duration:10 seconds Bending: 180°, >3 bends Torsion; 3 Rotation of 360°C Each |
No Mechanical Damage |
| Resistance to Soldering Heat | Temp
: 260°C ± 5°C Duration - 10 seconds |
R < ±0.5% +0.05 Ohm |
| Bump | 1500 Bumps X 3 directions | R < ±1.5% + 0.05 Ohm |
| Vibration (High Frqquency) | 10 to 500 Hz : 100m/S² | R < ±1.5% + 0.05 Ohm |
| Low Temperature Exposure | At
-65°C Duration : 2 hrs. |
R < ±1.5% + 0.05 Ohm |
| High Temperature Exposure | At
+155°C Duration : 16 hrs., No load condition. |
R < ±1.5% + 0.05 Ohm |
| Solderability | DIP
Method, solder Bath Temp : 230°C ±5°C Duration : 5 seconds |
> 95% |
| Resistance to Solvents | Solvent: Tricloroethylene Duration: 1 Minute |
MIL-STD 202 Method 215 |
© 1999 MFR Electronic Components Pvt. Ltd.